PLA HCP
- Abrasive strenght: high
- Shape: pyramid
- Sizes: 10-20
- Hardness: 3/5
- Duration: 3/5
- Step: grinding, frosting, deburring
- Target: removing of burr caused by shearing, pressing and lasering
Chips for wet system of polishing
Achieve optimal results with PAI CLASSIC's Ceramic and Plastic Abrasive Chips for Wet Polishing. These chips are ideal for various applications like polishing, leveling, deburring, grinding, and smoothing. Elevate your polishing processes with our abrasive chips.
Ceramic abrasive chips – TRIANGLE Grey – Smoothing
Ceramic abrasive chips – TRIANGLE Grey – Smoothing/Shining
Ceramic abrasive chips TRIANGLE Grey – Deburring/Grinding
Plastic abrasive chips – CONE Blue
Plastic abrasive chips – CONE Red
Plastic abrasive chips – CONE Green
Plastic abrasive chips – PYRAMID Blue
Plastic abrasive chips – PYRAMID Green
PLA HCCAP
